New Topology for MEMS Advances Performance and Speeds Manufacturing

Omnitron Sensors CEO & Co-founder Eric Aguilar will give attendees of MEMS & Imaging Sensors Summit (a SEMI Europe/MEMS & Sensors Industry Group event) a closer look at the company’s game-changing IP during his presentation: New Topology for MEMS Advances Performance and Speeds Manufacturing (November 14, 2024 at 5:25 pm at the International Conference Center Munich, Germany).

Eric will share new details on Omnitron’s new topology for MEMS — its process IP — which rearranges existing modules to streamline the assembly process and improve capacitance per unit area. This approach increases device performance and accelerates the production of MEMS devices for price-sensitive, high-volume markets.

Omnitron’s topology for MEMS may be applied to precision applications such as augmented reality, LiDAR, and optical cross-connects for AI workflow in datacenters among others.

There are multiple ways that Omnitron’s new topology for MEMS will be able to advance MEMS applications:

  • In terms of augmented reality, Omnitron’s miniature MEMS-based micro projector will let users experience the full potential of a see-through augmented environment.
  • Based on the new topology, Omnitron’s tiny 3D MEMS sensor fixes current issues with LiDAR which will benefit applications such as autonomous navigation and advanced driver assistance systems (ADAS), where precision and faultless operation are critical.
  • Optical cross-connect (OXC) for Tensor architectures built with Omnitron’s MEMS-based photonics will be able to deliver improved throughput and reliability in a low-power device, accelerating AI workflow in data centers.

Learn more about Eric’s presentation at MEMS & Imaging Sensors Summit: https://www.semi.org/eu/about/mems-imaging-sensors-summit/abstracts-and-biographies#Aguilar

Or contact Omnitron directly to learn how our new topology for MEMS can work for your application: https://omnitronsensors.com/contact-us/

Meet with Omnitron Sensors at MEMS & Sensors Executive Congress (MSEC)

MSEC (October 7-9, 2024, Bromont, Québec) is the MEMS industry’s not-to-be-missed annual executive conference. Tap into the leadership of the entire MEMS ecosystem—and connect directly with OEMs and integrators who are using MEMS in wide-ranging applications. You’ll make valuable connections at SEMI-MEMS & Industry Group’s flagship US event. Register by September 7 for your early bird discount.

Omnitron Sensors Selects Silex Microsystems for Reliable MEMS Scanner for LiDAR

MEMS IP company works with premier MEMS foundry to commercialize first product

LOS ANGELES—September 12, 2023 — Omnitron Sensors, the pioneer in MEMS sensing technology for high-volume, low-cost markets, today announced that it will work with Silex Microsystems on the manufacture of its microelectromechanical systems (MEMS) scanner for LiDAR.

“We’re seeing massive demand for low-cost and reliable LiDAR from manufacturers of automotive ADAS, drones and other robotic systems,´ said Eric Aguilar, co-founder and CEO, Omnitron Sensors. “Our selection of Silex Microsystems—the world’s largest pure-play MEMS foundry—signifies our market-readiness to deliver the first MEMS scanner that meets the accuracy, reliability, size, cost and volume requirements of LiDAR in diverse applications.” 

Solving MEMS manufacturing challenges

Manufacturing MEMS devices is notoriously difficult. Problems with size, reliability, durability and repeatability—and the fact that process technology is unique for each new MEMS device—make MEMS manufacturing expensive and slow design-to-delivery cycles. Omnitron’s core IP solves these challenges. As a new topology for MEMS, Omnitron’s IP rearranges manufacturing processes and supports them with new packaging techniques. This speeds volume production of a wide range of small, low-cost, precise MEMS sensors—from scanning mirrors and inertial measurement units (IMUs) to microphones, pressure sensors, and telecom switches. 

“Omnitron’s new topology for MEMS—which features the clever rearrangement of silicon process steps and a new packaging method—is a major step forward for the microelectronics industry because it mitigates the manufacturing complexity that has limited the growth of MEMS to date,” said Aguilar. “By leveraging the standard tools and processes already found in the Silex fab, Omnitron clears the way for robust, reliable and affordable MEMS devices that are delivered to market quickly and at high volume.”

For more information

To learn more about Omnitron Sensors, please contact us by email: info@omnitronsensors.com or via the Omnitron website.

About Omnitron Sensors

Founded in 2019 by a core group of MEMS industry innovators, Omnitron Sensors has invented a new topology for MEMS—IP that improves device performance and reliability, and that streamlines assembly to produce MEMS sensors for price-sensitive, high-volume markets. Learn more at https://omnitronsensors.com

The Omnitron Sensors logo is a registered trademark of Omnitron Sensors. All other product and company names are trademarks or registered trademarks of their respective holders.

Press Contacts

Eric Aguilar, Omnitron Sensors
Email: eric[at]omnitronsensors.com

Maria Vetrano, Vetrano Communications
Email: maria[at]vetrano.com