New Topology for MEMS Advances Performance and Speeds Manufacturing
Omnitron Sensors CEO & Co-founder Eric Aguilar will give attendees of MEMS & Imaging Sensors Summit (a SEMI Europe/MEMS & Sensors Industry Group event) a closer look at the company’s game-changing IP during his presentation: New Topology for MEMS Advances Performance and Speeds Manufacturing (November 14, 2024 at 5:25 pm at the International Conference Center Munich, Germany).
Eric will share new details on Omnitron’s new topology for MEMS — its process IP — which rearranges existing modules to streamline the assembly process and improve capacitance per unit area. This approach increases device performance and accelerates the production of MEMS devices for price-sensitive, high-volume markets.
Omnitron’s topology for MEMS may be applied to precision applications such as augmented reality, LiDAR, and optical cross-connects for AI workflow in datacenters among others.
There are multiple ways that Omnitron’s new topology for MEMS will be able to advance MEMS applications:
- In terms of augmented reality, Omnitron’s miniature MEMS-based micro projector will let users experience the full potential of a see-through augmented environment.
- Based on the new topology, Omnitron’s tiny 3D MEMS sensor fixes current issues with LiDAR which will benefit applications such as autonomous navigation and advanced driver assistance systems (ADAS), where precision and faultless operation are critical.
- Optical cross-connect (OXC) for Tensor architectures built with Omnitron’s MEMS-based photonics will be able to deliver improved throughput and reliability in a low-power device, accelerating AI workflow in data centers.
Learn more about Eric’s presentation at MEMS & Imaging Sensors Summit: https://www.semi.org/eu/about/mems-imaging-sensors-summit/abstracts-and-biographies#Aguilar
Or contact Omnitron directly to learn how our new topology for MEMS can work for your application: https://omnitronsensors.com/contact-us/
